英文缩写

Bonded and Etchback Silicon On Insulator

英文缩写:BESOI

英文全称:Bonded and Etchback Silicon On Insulator

中文释义:在绝缘体上粘合和蚀刻硅

中文拼音:zài jué yuán tǐ shàng nián hé hé shí kè guī

所属分类:Academic & Science